Sensor based registration and stacking of electronic substrate layers
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En: IEEE Robotics and automation magazine (vol. 2, nro. 4, Dec. 1995), p. 30-35S.T.:H007.52 ROBO PP2912
This sensor-based approach for registration and stacking of electronic substrate sublaminates replaces pin-in-slot methods, yet does not require accurate automation equipment. Tests of a pilot workcell for this approach showed that the contact holes were consistently aligned to 2.5 µm (3s), more than ten times better than the traditional mechanical method
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This sensor-based approach for registration and stacking of electronic substrate sublaminates replaces pin-in-slot methods, yet does not require accurate automation equipment. Tests of a pilot workcell for this approach showed that the contact holes were consistently aligned to 2.5 µm (3s), more than ten times better than the traditional mechanical method
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